Dispersion of nanodiamond and ultra-fine polishing of quartz wafer_中国颗粒学会

Dispersion of nanodiamond and ultra-fine polishing of quartz wafer_中国颗粒学会

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Partic. vol. 2 no. 4 pp. 153-156 (August 2004)
doi: 10.1016/S1672-2515(07)60046-3

Dispersion of nanodiamond and ultra-fine polishing of quartz wafer

Yongwei Zhu^a,b,*, Zhijing Feng^a, Baichun Wang^b, Xianyang Xu^b,c

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y.w.zhu@263.net

Abstract

Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8∼11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodiamond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of quartz wafer involves atom-level removal under the synergism of chemical and mechanical actions.

Keywords

nanodiamond; dispersion; mechanochemical modification; ultra-fine polishing; quartz wafer